Package semiconductor device using chalcogenide glass sealing
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United States of America Patent
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-
Sep 4, 1990
Issued Date -
N/A
app pub date -
Sep 8, 1983
filing date -
Dec 12, 1979
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes a package hermetically sealed with a chalcogenide-based glass sealing agent. A semiconductor element is housed within the package, and the respective electrodes of the semiconductor element are connected through bonding wires to leads extending to the outside of the package.
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