Process for applying conductive terminations to ceramic components
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United States of America Patent
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Sep 4, 1990
Grant Date -
N/A
app pub date -
May 25, 1989
filing date -
May 25, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In this process a conductive first layer composed of finely divided metal and finely divided ceramic material in an organic carrier is applied to a surface of an unsintered ceramic body. The conductive layer forms terminations when the body, and the conductive layer are cofired to sinter and form a unitary, integral, monolithic structure. A second conductive metal layer may be applied to the first layer prior to cofiring to improve attachment capabilities of the component. Leads may be attached to the conductive terminations if desired.
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