System and method for vacuum deposition of thin films
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United States of America Patent
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Aug 28, 1990
Grant Date -
N/A
app pub date -
Feb 17, 1989
filing date -
Feb 17, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A vacuum evaporation plasma plating system is disclosed in which the plasma and the crucible containing the evaporant material are part of an electrical circuit which effects vacuum evaporation operation. The crucible includes a constant anode cap which is heated by the plasma and thus maintains a low resistance circuit path to the crucible and also provides a uniform source of evaporant.
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