Apparatus for transporting wafer to and from polishing head
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United States of America Patent
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-
Jul 31, 1990
Grant Date -
N/A
app pub date -
Jun 20, 1988
filing date -
Jun 20, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
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