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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TANAKA DENSHI KOGYO K K A CORP OF JAPAN	6-6 NIHONBASHI KAYABA-CHO 2-CHOME CHUOH-KU TOKYO

International Classification(s)

• C22C:ALLOYS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kujiraoka, Takeshi	c/o Tanaka Denshi Kogyo Kabushiki Kaisha, 6-6, Nihonbashi Kayaba-cho,, Chuoh-ku, Tokyo, JP	4	31
Kurihara, Kenichi	c/o Tanaka Denshi Kogyo Kabushiki Kaisha, 6-6, Nihonbashi Kayaba-cho,, Chuoh-ku, Tokyo, JP	59	432
Mukoyama, Koichiro	c/o Tanaka Denshi Kogyo Kabushiki Kaisha, 6-6, Nihonbashi Kayaba-cho,, Chuoh-ku, Tokyo, JP	3	24
Yamamoto, Hiromi	c/o Tanaka Denshi Kogyo Kabushiki Kaisha, 6-6, Nihonbashi Kayaba-cho,, Chuoh-ku, Tokyo, JP	34	200

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 4938923

Gold wire for the bonding of a semiconductor device

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