Film carrier having tin and indium plated layers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 19, 1990
Grant Date -
N/A
app pub date -
Dec 9, 1988
filing date -
Jun 25, 1987
priority date (Note) -
Expired
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Abstract
Film carriers for mounting electronic components such as semiconductor chips thereon have lead portions plated with a tin or tin alloy layer and further with an indium layer. The tin or tin alloy layer is 0.1-3 .mu.m thick and the indium layer 0.01-2 .mu.m thick. Alternatively, the leads have a tin or tin alloy plated portion having an indium diffusion layer, with an indium content of 0.2-50 wt %. The carriers are manufactured by a method which comprises plating the leads with tin or a tin alloy and then with indium, with or without heat treatment at 50.degree.-150.degree. C. to form an indium diffusion layer in the tin or tin alloy coating. Plating is done by electroless plating.
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