Cyanide-free copper plating process
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United States of America Patent
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Jun 12, 1990
Grant Date -
N/A
app pub date -
Jul 24, 1989
filing date -
Jul 24, 1989
priority date (Note) -
Expired
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Abstract
A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independently from the current to the soluble copper anode in order to reduce the level of bath impurities and maintain the quality of the deposit.
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