Cradle for supporting printed circuit board between plating manifolds
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United States of America Patent
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Jun 12, 1990
Grant Date -
N/A
app pub date -
Apr 3, 1989
filing date -
Apr 3, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a system for electroplating a printed circuit board in which multiple spray orifices are provided in arrays on opposite sides of the circuit board, and multiple vacuum orifices are interspersed symmetrically and midway between adjacent spray orifices, a mounting means is provided for rapid and accurate locating of the printed circuit board in two selectively offset alternative positions to facilitate forming an electroplated layer of uniform thickness. The printed circuit board is supported from an elongate copper bar, with two alignment members mounted to opposite ends of the bar. A pair of saddles are fixed with respect to the tank containing the electrolyte. Each of the saddles has two V-shaped mounting surfaces conforming to the alignment members for a nesting engagement. The mounting surfaces of each saddle are offset from one another a predetermined horizontal and vertical distance, whereby alternative nesting engagements of the alignment members and saddles support the circuit borad in alternative positions, respectively aligning particular circuit board surface areas with spray orifices, and then with vacuum orifices.
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