Method for the preparation of a bonding tool
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United States of America Patent
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Jun 12, 1990
Grant Date -
N/A
app pub date -
May 9, 1989
filing date -
Jun 24, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bonding tool to be employed for preparing semiconductor parts, e.g., IC, comprizing a tool-head made of a super hard material, e.g., a single crystal of diamond, etc., which comes into contact with a workpiece in the use of the bonding tool and a shank to which the tool-head is bonded by brazing with a brazing material is prepared by using a silver solder based brazing composition obtained by adding a fine powder for shrinkage-stress-relieving material, e.g., fine diamond powder, etc., to a conventional silver solder based brazing material to which titanium has been added as the brazing material. The method is advantageous in that bonding tools having improved properties; i.e., high brazing strength, high stability in practical use, low brazing strain, low thermal stress etc., can be prepared in a good yield with preventing a crack in the super hard material used as a tool-head of the bonding tools.
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