Multilayer interconnect and method of forming same
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United States of America Patent
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May 15, 1990
Grant Date -
N/A
app pub date -
Feb 12, 1986
filing date -
Feb 12, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer interconnect and method of forming the same between first and second overlying conductive strips separated by an insulating layer having an aperture therethrough. The improvement wherein at least one edge of the first strip is aligned with an overlying edge of the second strip. The interconnect is formed by depositing the second strip on the insulating layer such that it at least partially overlaps the aperture and extends beyond an edge of the first strip. The second strip and first strip are then partially removed such that at least one edge of the first and second conductive strips are aligned.
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