High temperature interconnect system for an integrated circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 24, 1990
Issued Date -
N/A
app pub date -
Aug 18, 1987
filing date -
Mar 15, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor integrated circuit device is provided with an electrical interconnect system which is stable at high temperatures. The interconnect system employs refractory metal compounds which are electrically conductive, which form stable couples with silicon and compounds thereof, and which remain stable at temperatures exceeding approximately 500.degree. C.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully