Apparatus for bonding a low density material to a plastic substrate
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United States of America Patent
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Apr 24, 1990
Issued Date -
N/A
app pub date -
Feb 10, 1989
filing date -
Sep 17, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for and a method of bonding low density or thin gauge polyurethane foams to polypropylene substrates, said apparatus including, a revolvable turntable for indexing the workpieces to various work stations, a conductive heating station to heat-liquify designated areas of the polypropylene substrate, and a compression station having compression platens to emboss the polyurethane foam onto the polypropylene substrate effectively fusing the fibers of the polyurethane foam with the heat-liquified areas of polypropylene. The method generally includes the steps of, engaging the surface of a precut polypropylene substrate with a heated member for a predetermined period of time to cause the polypropylene to heat-liquify at the points of contact forming a raised quantity of melted polypropylene, removing the heated member from contact with the polypropylene, placing a pre-cut sheet of polyurethane foam into contact with the melted polypropylene, applying pressure to the polyurethane foam so as to fuse the fibers thereof with the melted polypropylene, and permitting the fused polyurethane and polypropylene to cool effectively bonding them together.
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