Electroless gold plating solutions
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 24, 1990
Grant Date -
N/A
app pub date -
Jun 30, 1988
filing date -
Jun 30, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electroless or autocatalytic gold plating solutions having increased stability through the use of a non-aqueous solvent, preferably ethylene glycol, in an amount of between 50 and 100% of the base solution. Also, the excess free cyanide content of this solution can be controlled at optimum levels by periodic additions of a strong inorganic oxidant such as sodium hypochlorite without adversely affecting the other solution components.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully