Solder leveller
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 3, 1990
Grant Date -
N/A
app pub date -
Nov 25, 1988
filing date -
May 29, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder leveller comprises a solder bath into which a printed circuit board can be dipped to be preliminarily tinned. A pair of upright laterally acting jaws are adapted along an extended part of their length to hold the board at its opposite side edges and operate to insert in and withdraw the board from the bath. An air knife removes excess solder. The jaws are guided centrally of the bath by engagement of the side faces with the air knife nozzles which act as fixed guides.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully