Laminated printed circuit board and process for its manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 27, 1990
Grant Date -
N/A
app pub date -
Nov 21, 1988
filing date -
Mar 4, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process is provided for making a laminated board useful in printed circuitry. The process involves laminating a metal layer to at least one side of a sheet of porous, expanded polytetrafluoroethylene using an adhesive followed by compressing the polytetrafluoroethylene sheet to increase its density. The metal layer may be a metal foil or it may comprise electrical circuitry. Also provided are printed circuit boards produced by the aforesaid process.
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