EMI and RFI shielding and antistatic materials and processes for producing the same
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United States of America Patent
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Mar 20, 1990
Grant Date -
N/A
app pub date -
Sep 28, 1987
filing date -
Sep 28, 1987
priority date (Note) -
Expired
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Abstract
The present invention provides a multilayer fibrous material suitable for use as an EMI and RFI shielding packaging material and a process for producing the same comprising first and second outer layers formed of paper or paperboard and an inner layer formed of paper or paperboard containing conductive carbon. The invention also provides a method of providing antistatic properties to the packaging material.
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