System and method for providing a conductive circuit pattern utilizing thermal oxidation
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United States of America Patent
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Mar 20, 1990
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N/A
app pub date -
Apr 11, 1989
filing date -
Apr 11, 1989
priority date (Note) -
Expired
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Abstract
A system and method for improved conductive circuit patterning utilizing laser ablation is disclosed. In an embodiment, a substrate, which has an electroless conductive layer plated thereon, is heated to a predetermined temperature for a predetermined time to form an oxide layer upon the conductive layer. The oxide layer, due to its non-absorptive properties, is more easily ablated than the conductive layer. Hence, the overall processing time for circuit patterning is significantly reduced.
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