Molded article with partial metal plating and a process for producing such article

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United States of America Patent

PATENT NO 4908259
SERIAL NO

07180923

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Abstract

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This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after the roughing of the surface of the primary molded article, and then, the molded article is inserted into the mold and molded so that the portions to be plated with metal are exposed, and after such molding, the exposed portions are plated with metal.

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Patent Owner(s)

Patent OwnerAddress
SANKYO KASEI KABUSHIKI KAISHA A CORP OF JAPAN11-14 KUGAHARA 2-CHOME OTA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yumoto, Tetsuo Tokorozawa, JP 14 122

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