Universal edged-based wafer alignment apparatus
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United States of America Patent
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Mar 6, 1990
Issued Date -
N/A
app pub date -
Mar 21, 1986
filing date -
Mar 30, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for aligning a wafer. The edge of a wafer is mapped by means of a photodetector array and a light source to provide a signal representative of the X-Y position and angular orientation of the wafer as the wafer is rotated one revolution on a shaft. The signal is digitized and processed to provide stored information of the X-Y position and angular orientation of the wafer. The shaft is then rotated to move the wafer from its calculated angular orientation to a desired angular orientation. The X-Y positional information may be used to center the wafer.
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