Adhesives useful for production of corrugated board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4906679
SERIAL NO

07277557

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A process for production of corrugated board using an aqueous adhesive which contains polyvinyl alcohol and clay, or polyvinyl alcohol, clay and water-soluble boron compound, the ratio of clay to polyvinyl alcohol being in the range of 200 to 600 parts by weight based on 100 parts by weight of polyvinyl alcohol, the ratio of water-soluble boron compound being not more than 15 parts by weight based on 100 parts by weight of polyvinyl alcohol, the solid content of the adhesive being 25 to 60% by weight characterized in that (a) a polyvinyl alcohol concentration in the solution excluding solid other than polyvinyl alcohol from adhesive being in the region bounded by the following formulas: Y.gtoreq.-0.0014 X+9.4 (i) Y.ltoreq.-0.0061 X+26.3 (ii) 200.ltoreq.X.ltoreq.3500 (iii) wherein Y is defined by the following formula: ##EQU1## and X is degree of polymerization of polyvinyl alcohol, (b) the viscosity of the adhesive measured by a Brookfield viscometer being from 200 to 6000 centipoises at 85.degree. C., and the rate of increase of the viscosity of the adhesive being in the range of 1.5 to 8 times when the temperature of adhesive is dropped from 85.degree. to 30.degree. C., (c) the adhesive, of which temperature is 60.degree. to 95.degree. C., being applied onto the flute tips of corrugated medium to manufacture corrugated board, and an aqueous adhesive therefor. The process for production of a corrugated board has excellent effect on heat energy saving characterized in that said corrugated board can be manufactured at high speed without heating after application of the water-base adhesive at a temperature of 60.degree.-95.degree. C., and the adhesive is easy to handle and has improved adhesion property.

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Patent Owner(s)

Patent OwnerAddress
KURARAY CO LTD1621 SAKAZU KURASHIKI-SHI OKAYAMA 7100801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kohno, Hiroji Kurashiki, JP 4 30
Koyakumaru, Takatoshi Kyoto, JP 3 22
Okaya, Takuji Nagaokakyo, JP 34 488
Onishi, Hiroyuki Kawanishi, JP 128 1260
Shirakawa, Kinichi Takatsuki, JP 3 23
Tokuno, Masateru Nishinomiya, JP 43 583

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