Semi-conductor device
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United States of America Patent
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Feb 20, 1990
Issued Date -
N/A
app pub date -
Mar 27, 1989
filing date -
May 1, 1986
priority date (Note) -
Expired
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Abstract
A semi-conductor device in which a semi-conductor element is sealed with a molding resin is disclosed. In the device, adhesion between a semi-conductor chip and the molding resin is achieved mainly by oxygen-crosslinking between silicon in the semi-conductor chip and silicon in the molding resin. The device exhibits excellent moisture-resistant reliability even after mounting.
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