Importance

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Abstract

A flex dot wafer probe having utility as an electrical interface between semiconductor wafers and electronic test systems for determining the electrical integrity and performance of integrated circuits. The wafer probe comprises a wafer probe head having a preformed resilient, bendable, formable film mounted on a support member for flexible movement. The wafer probe head is integrated with a probe board which interfaces with an external test system. Wafer contact pads and protrusions are formed on the film in 'mirror-image' patterns corresponding to the contact elements of the integrated circuits and interface contact pads of the probe board, respectively. Coplanar line conductors, formed to control the characteristic impedance of the wafer probe head, provide electrical continuity between the wafer contact pads and the protrusions. The conductive protrusions formed on the wafer contact pads and the film physically and electrically engage the contact elements of the integrated circuits and the probe board, respectively, thereby providing electrical paths for test signals between the external test system and the integrated circuits. The flexible configuration of the wafer probe head ensures that all protrusions are forcibly urged into physical and electrical engagement with the corresponding external contact elements at an acceptable force level which precludes deformation of the protrusions.

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First Claim