Method for providing a strengthened conductive circuit pattern
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 6, 1990
Grant Date -
N/A
app pub date -
Nov 15, 1988
filing date -
Nov 15, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for providing a circuit pattern on an insulated substrate that has improved adherence thereto. By providing an electroless conductive layer of a predetermined thickness on the substrate and thereafter exposing the substrate to an ablative laser beam, the resultant conductive lines are stronger than those provided by previously known techniques.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully