Semiconductor wafer array
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United States of America Patent
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-
Jan 30, 1990
Grant Date -
N/A
app pub date -
Jul 17, 1986
filing date -
Jul 17, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers. The conductive liquid is electrically insulated from all parts of the wafers except a part comprising an electrically conductive bonding pad which provides an electrical path between the conductive liquid and transistors located in the wafers. The wafers, which are disposed in a stack one on top of the other, are mounted in an enclosure and coupled to electrical pin members for connection to external devices.
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