Printed circuit substrate
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United States of America Patent
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-
Jan 23, 1990
Grant Date -
N/A
app pub date -
Sep 23, 1988
filing date -
Nov 20, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A printed circuit is provided wherein the electrically conductive material which forms the circuit elements is embedded within a dielectric substrate. The preferred dielectric substrate is porous, expanded polytetrafluoroethylene.
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