Lead frame having projections for resin molding
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United States of America Patent
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Jan 16, 1990
Grant Date -
N/A
app pub date -
Dec 12, 1988
filing date -
Jan 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead frame comprising an inner lead part to be electrically connected to an internal device and contained within a mold cavity for being resin molded, and an outer lead part connected to the inner lead part, the inner lead part having a projection with which a resin flow having passed through a mold gate collides. Because the resin flowing through the mold gate collides with the projection near a cavity inlet and disperses, the molding resin can reach corners near the cavity inlet, and air can be purged off from the corners to obtain a no-void, satisfactory appearance of semiconductor package.
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