Method and apparatus for reflow soldering of electrical component leads, including floating heater bar
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 16, 1990
Grant Date -
N/A
app pub date -
Sep 20, 1988
filing date -
Sep 20, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of reflow soldering a row of electrical component leads to a printed circuit board using a heater bar is disclosed. The method involves the steps of, firstly, moving the heater bar to a position above the location of the leads and allowing the heater bar to rock within its plane to float into proper position, and secondly, then clamping the heater bar, supplying voltage to heat the heating element portion of the heater bar, and applying soldering pressure. Corresponding apparatus is disclosed, in which the heater bar is adapted to rock within its plane. The heater bar has a support arm projecting upwardly from the heating element portion. A carriage includes a channel which accommodates the support arm and is somewhat larger in the horizontal dimension in the plane of the heater bar, thereby allowing the heater bar to rock. A clamping bar is movable into the channel for clamping the heater bar via the support arm. Voltage is supplied to the heating element though the contacts between positive and negative contact portions of the clamping bar and support arm respectively.
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