Process for the passivating anodization of copper in a medium of molten fluorides, and use for the protection of copper parts of fluorine electrolysers
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United States of America Patent
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Jan 9, 1990
Grant Date -
N/A
app pub date -
Feb 23, 1989
filing date -
Jun 26, 1987
priority date (Note) -
Expired
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Abstract
A process for producing a strong, adherent protective layer on copper parts, with a high rate of covering of the substrate, by passivating anodization, characterized in that the copper parts are immersed in a liquid KF, 2HF bath and subjected to anodic current of low surface-related density which is less than 0.1 A/dm.sup.2, which current may be continuous or intermittent.
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