Method for doping silicon wafers using Al.sub.2 O.sub.3 /P.sub.2 O.sub.5 composition
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United States of America Patent
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Jan 2, 1990
Grant Date -
N/A
app pub date -
Jan 21, 1988
filing date -
Jan 21, 1988
priority date (Note) -
Expired
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Abstract
A doping composition and method for doping a silicon wafer with phosphorous in which the composition contains (A) a high purity Al.sub.2 O.sub.3 /P.sub.2 O.sub.5 compound having a mole ratio of P.sub.2 O.sub.5 /Al.sub.2 O.sub.3 of about 1/1 to 4/1: and (B) a vehicle for the Al.sub.2 O.sub.3 /P.sub.2 O.sub.5 compound for application as a paste to provide a thin layer on the silicon wafer which is fired to provide an easily-removed powdery layer on the wafer.
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