Soldering apparatus
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United States of America Patent
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-
Dec 26, 1989
Grant Date -
N/A
app pub date -
Jun 16, 1988
filing date -
Jun 16, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering apparatus capable of forming a flowing layer of a molten solder with which an article to be soldered is contacted and the height of the upper surface of which is automatically controlled between predetermined upper and lower levels by continuously detecting the upper surface with two detectors. Each detector has a vertical pipe whose top is connected to a source of a pressurized gas and whose bottom is opened downward so that the pressure within the pipe is increased or released when the upper surface of the solder is positioned above or below the open bottom end of the pipe. A pressure switch is provided in each pipe to detect the increase and decrease of the pressure within the pipe to detect the upper surface of the solder layer.
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