Method for manufacturing plastic encapsulated semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4888307
SERIAL NO

07090142

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.

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Patent Owner(s)

Patent OwnerAddress
SGS MICROELETTRONICA S P A STRADALE PRIMOSOLE N 50 - 95121 CATANIA ITALYNot Provided

International Classification(s)

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  • 1987 Application Filing Year
  • H01L Class
  • 1607 Applications Filed
  • 11 Patents Issued To-Date
  • 0.69 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances1987198819891990199119921993199419950255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cellai, Marino Agrate Brianza, IT 3 91
Spairisano, Antonio P Palermo, IT 1 47

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Patent Citation Ranking

  • 47 Citation Count
  • H01L Class
  • 0 % this patent is cited more than
  • 36 Age
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