Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink
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United States of America Patent
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-
Dec 12, 1989
Grant Date -
N/A
app pub date -
Jul 14, 1987
filing date -
Jul 17, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for semiconductor devices provided with an encased metallic heat sink, wherein an encapsulating body of resin extends beyond the perimenter of the heat sink to form two side extensions, diametrically opposite with respect to a central portion of the body and elastically de-coupled from such a central portion of the resin body containing the heat sink and the semiconductor chip, by means of at least a thinned out zone of the resin body determined by one or more pairs of opposite grooves. Fastening points contemplated in said lateral extensions, are efficiently elastically de-coupled from the central portion of the body and the package is essentially free to blend along said pairs of opposite grooves without inducing stresses on the encased metallic heat sink onto which rests the semiconductor chip.
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