Polyimide film-forming polyamide acid solution
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United States of America Patent
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Nov 14, 1989
Grant Date -
N/A
app pub date -
Mar 31, 1987
filing date -
Mar 31, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A polyamide acid solution is disclosed, comprising a polyamide acid comprising as main components at least one recurring unit selected from the recurring units of the formulae (I) to (IV) and a recurring unit of formula (V), dissolved in an organic solvent comprising as a main component an amide type polar solvent having a boiling point of 170.degree. C. or less. The solution is capable of forming a polyimide film which has colorless transparency free from coloration and strong adhesion to a substrate for liquid crystal cell enough to prevent penetration of water into interface between the substrate and film. The solution is particularly useful for forming a liquid crystal oriented film.
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