Tin, lead or tin/lead alloy electrolytes for high speed electroplating
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United States of America Patent
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Nov 14, 1989
Issued Date -
N/A
app pub date -
Dec 9, 1988
filing date -
Dec 10, 1987
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Expired
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Abstract
An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less carbon atoms and at least one hydroxy group, or (2) an aromatic organic compound having at least one hydroxyl group and no more than two independent or joined rings optionally substituted with an alkyl moiety of a total of twenty carbon atoms in one or six carbon atoms or less.
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