Regeneration of copper etch bath
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United States of America Patent
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Nov 14, 1989
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N/A
app pub date -
Apr 13, 1987
filing date -
Apr 13, 1987
priority date (Note) -
Expired
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Abstract
This invention relates to a copper etching process which involves contacting the copper with an aqueous etching solution comprising sulfuric acid and a peroxide to which is added less than about 0.2% of an organic additive useful as a crystallization control agent and selected from the group consisting of a low molecular weight glycol and gum arabic. With this compound present, copper sulfate crystals do not adhere to the tank and removal of the crystals from the bath is facilitated.
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