Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior
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United States of America Patent
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Nov 7, 1989
Issued Date -
N/A
app pub date -
Apr 18, 1988
filing date -
Jun 19, 1986
priority date (Note) -
Expired
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Abstract
An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of (I) An epoxy resin component and (II) A hardener component and (III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.
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