Conductor composition and method of manufacturing a ceramic multilayer structure using the same
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United States of America Patent
Stats
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Oct 31, 1989
Grant Date -
N/A
app pub date -
Apr 13, 1988
filing date -
Apr 13, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a conductor paste effective to manufacture a ceramic multilayer structure. The conductor paste comprises an inorganic component containing CuO as a main component and at least one of Cu and Cu.sub.2 O. A multilayer body of the conductor paste and a dielectric paste is subjected to a binder removing process in air, a reduction process in a mixed gas of hydrogen and nitrogen, and a firing process in nitrogen, thereby to obtain a ceramic multilayer structure.
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Patent Citation Ranking
- 11 Citation Count
- H01B Class
- 0 % this patent is cited more than
- 36 Age