Soldering apparatus
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United States of America Patent
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-
Oct 24, 1989
Grant Date -
N/A
app pub date -
Jul 14, 1988
filing date -
Jul 14, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering apparatus of a type in which printed circuit boards having temporarily mounted thereon chip parts with solder paste are heated within a heating chamber to cause the solder paste to reflow. The heating chamber is partitioned into preheating chamber or chambers and a reflowing chamber, with each preheating chamber being divided into gas flow channels and center space through which the board is transferred and in which a heater, flow control plates and a fan are provided so that the hot air heated with the heater in each preheating chamber is forcibly recirculated within each chamber to preheat the board uniformly. The preheated board is transferred to the reflowing chamber provided with far infrared radiation lamps to cause the solder paste to reflow.
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