Laser drilling of components
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United States of America Patent
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Oct 10, 1989
Issued Date -
N/A
app pub date -
Jun 13, 1988
filing date -
Jun 13, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for drilling holes through a component (16) from a first surface to a second surface. The method includes the step of applying a thixotropic water soluble medium to the second surface. The medium contains material to disperse the laser light and light emitting material (which could be fluorescent, phosphorescent or luminescent). Monitoring means and beam splitter are provided for monitoring light emitted, or reflected, by the component 16, along the length of the hole drilled by the laser and for monitoring light emitted by the medium. In this way one can detect when the laser breaks through the second surface and also produce an image indicative of the size and shape of the hole.
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