Curable resin from bis-maleimide and alkenyl phenyl hydroxy ether
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United States of America Patent
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Oct 3, 1989
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app pub date -
Mar 25, 1988
filing date -
Jan 18, 1986
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Expired
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Abstract
Cured resins of high fracture toughness are prepared from N,N'-bisimides of formula I ##STR1## and alkenyl compounds of formula II D(G).sub.m II in which D is an m-valent group and G represents a phenyl ring having at least one alkenyl (e.g. allyl or 1-propenyl) substituent.
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