Limiting tin sludge formation in tin or tin/lead electroplating solutions
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United States of America Patent
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Oct 3, 1989
Issued Date -
N/A
app pub date -
Apr 29, 1988
filing date -
Sep 11, 1981
priority date (Note) -
Expired
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Abstract
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
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