Method and apparatus for gas conditioning by low-temperature vaporization and compression of refrigerants, specifically as applied to air

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United States of America Patent

PATENT NO 4866947
SERIAL NO

07268878

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thermodynamic constant volume vapor compression heat pump system including method and apparatus wherein a closed fluid loop having first, intermediate and second treatment stations, is employed. A liquid refrigerant fluid under low pumping pressure is introduced to a first treatment station following initial expansion, accelerating propulsion, and atomization thereof, precedent to evaporation of the refrigerant fluid through a divisive containment of the accelerated refrigerant fluid. A counterflowing of a warm contained fluid under treatment occurs in heat-exchange conduction relation to the refrigerant fluid, proximal the vaporizing refrigerant of the laminar flow thereof is distrubed at no greater than one atmosphere; thereafter the vaporized refrigerant fluid is compressed at an intermediate station while diverting no greater a measure than 10% thereof to sequentially augment propulsion of oncoming liquid refrigerant through said first station; then, the remaining bulk of compressed refrigerant fluid is passed under high pressure through a second treatment station wherein the compressed refrigerant vapor is sequentially condensed by reverse-evaporation, the compressed refrigerant fluid being subjected at said second station to external conductive influence of a coolant fluid, said respective coolant fluids being divisively confined in counterflow conduction relation, and the steps aforesaid are repeated seriatim, cyclically.

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Patent Owner(s)

Patent OwnerAddress
THERMOTEK INC A CORP OF DE3286 M ST N W P O BOX 3559 WASHINGTON DC 20007

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Webster, Sherwood F Washington, DC 6 38

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