Sticking and cutoff device for adhering adhesive tape on thin articles
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United States of America Patent
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-
Sep 12, 1989
Grant Date -
N/A
app pub date -
Oct 7, 1987
filing date -
Aug 11, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device for sticking adhesive tape to thin articles, such as semiconductor wafers, and trimming excess portions of said tape from the thin articles. A plurality of sticking rollers apply adhesive tape from a roll to each thin article, the tape having an adhesive side oriented towards an upper surface of the article and a width greater than a width of the article. A suction stage receives and holds each of the thin articles with the adhesive tape stuck thereto by said sticking rollers while a tape cutter trims the excess portion of the tape from along peripheral edge portions of the article. A tape peeling device then peels off the trimmed excess portions of the tape from the thin article, whereupon the thin article is conveyed back to a cassette.
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