Substrates with dense metal vias
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United States of America Patent
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Aug 29, 1989
Grant Date -
N/A
app pub date -
May 22, 1987
filing date -
May 22, 1987
priority date (Note) -
Expired
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Abstract
Dense vias may be made with a metallizing composition containing tungsten, alumina, and either nickel or palladium. Further, an infiltration process ensures that vias in ceramic substrates are heremetic. Infiltrating materials, including metals and alloys, are applied to co-fired substrates and the composite is fired. The process may be repeated if necessary. Alternatively, the via holes may be bore-coated prior to infiltrating.
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