Temperature sensor using thermocouple
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United States of America Patent
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Aug 29, 1989
Grant Date -
N/A
app pub date -
Aug 23, 1988
filing date -
May 16, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A temperature sensor using a thermocouple, optimum for measurement of temperature of an object heated to a high temperature such as the tip of a soldering iron. Comprising a thermocouple formed by mutually bonding dissimilar metal materials, the junction of the dissimilar metal materials of thermocouple is covered with a good conductive metallic sleeve, and the measuring part is formed. Therefore, if an object high temperature contacts with the measuring part, the metal materials composing the thermocouple are not directly heated, and heat conduction to the metal materials is also excellent. Therefore, oxide coating due to heating rarely occurs in the measuring part, and the measuring performance of high precision may be maintained for a long period.
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