Method for fastening electronic components to a substrate using a film
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United States of America Patent
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Aug 15, 1989
Grant Date -
N/A
app pub date -
Dec 11, 1987
filing date -
Dec 22, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
For fastening electronic components to substrates, a connecting layer having good adhesion and good electrical and thermal conductivity is manufactured by sintering from a metal powder layer. A paste formed of metal powder, such as a silver powder, and of a solvent, is processed into a solvent-free presintered film in a separate process. This film is punched in accordance with a cross-section of the component and is provided for fastening the component. In manufacturing the film, a specific solvent is employed, together with heating up rates of 5.degree. to 30.degree. C./Min and holding times of 0.5 to 5 minutes at a maximum temperature of 300.degree. C. The fastening is carried out at temperature of at least 150.degree. C. and at a minimum mechanical pressure of 30 N/cm.sup.2. The use of a film speeds up the method and enables of sintering at low temperatures and, at the same time, at low mechanical pressure.
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