Auatomatic inspection system for IC lead frames and visual inspection method thereof

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United States of America Patent

PATENT NO 4851902
SERIAL NO

07082097

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Abstract

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The a system includes a visual inspection unit, a plating thickness inspection unit, and a shape inspection unit, suitably arranged in combination on the inspection line for automatic inspection of stains, flaws, glossiness or deformation in plated IC lead frames. The system can be used by an inventive method to correct errors in positional relation between a reference image and images input from an inspection camera, to obtain a comparison between a reference luminance curve and the individual luminance curves and the correlation between reflectivity and the corresponding area, and to obtain a comparison between the reference correlation and individual correlations to thereby enhance automation and precision in inspection IC lead frames.

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Patent Owner(s)

Patent OwnerAddress
ELECTROPLATING ENGINEERS OF JAPAN LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kishi, Takaaki Kanagawa, JP 8 116
Murata, Yasuto Kanagawa, JP 6 54
Tezuka, Junichi Kanagawa, JP 81 433

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