Importance

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Abstract

A method and an apparatus for applying molten wax to one face of a wafer is disclosed. A container having an upwardly facing opening contains the molten wax. The wafer is held substantially horizontally above the opening of the container, with one face of the wafer facing downwardly toward the opening of the container. At least one of the container and the wafer is moved toward the other to bring the opening of the container and underside of the wafer into contact with each other to thereby apply a predetermined amount of molten wax within the container to the underside of the wafer. Preferably, the container is filled with the molten wax such that the molten wax stands up, under surface tension, above a peripheral edge of the opening of the container. Preferably, the wafer is spinned around its central axis in a high speed so that the molten wax applied at the central portion thereof is spread on the entire surface of the wafer and that the extra wax is scattered out of the wafer. Preferably, walls surrounding the spinning wafer is heated at a temperature higher than the melting point of the wax so that the wax spinned off the wafer may not scatter in the air as particles.

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First Claim