Soldering apparatus
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United States of America Patent
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-
Jul 18, 1989
Issued Date -
N/A
app pub date -
Dec 15, 1987
filing date -
Feb 12, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for soldering printed circuit boards moving along a predetermined path of travel, comprises an upwardly extending nozzle member having an opening at its top end from which molten solder is caused to overflow to form an overflowing molten solder with which the underside surface of the printed circuit board is contacted, and an adjustable outlet member rotatably disposed in the opening to define an outlet extending in the direction transverse to the path of travel, so that by adjusting the angular position of the outlet member the orientation of the outlet may be varied for adjustment of the direction and height of the overflowing solder.
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