Preparation of printed circuit boards by selective metallization
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United States of America Patent
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Jul 11, 1989
Issued Date -
N/A
app pub date -
Jun 1, 1988
filing date -
Jan 26, 1984
priority date (Note) -
Expired
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Abstract
The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.
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